4-layer HDI board

Plate thickness: 1.6MM

Copper thickness: 1/H/H/1OZ

Ink: Blue oil white characters

Drilling: L1-L2 0.1MM, L2-L3 0.2MM, L3-L4 0.1MM, L1-L4 0.2MM

Line width and spacing: 4/4MIL

BGA:  10MIL

Surface treatment: sinking gold

Special process: HDI

Application field: WIFI module