4-layer half hole plate

Plate thickness: 0.8MM

Copper thickness: 1/1/1/1OZ

Ink: Green Oil White Characters

Drilling: L1-L2 0.1MM, L2-L3 0.2MM, L3-L4 0.1MM, L1-L4 0.2MM

Line width and spacing: 4/4MIL

Inner layer hole to line distance: 8MIL

BGA: 10MIL

Surface treatment: sinking gold

Special process: half hole 0.5MM

Application field: Bluetooth module